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LS-FPRO

LS-FPRO

CUSTOMIZABLE LASER PROCESSING MACHINE FOR HIGH ACCURACY APPLICATIONS

LS-FPRO is a versatile workstation designed for high demanding  laser processing applications where nanometer resolutions and laser spot sizes down to 1 micron are required. The main heavy granite structure with pasive dampers and  advanced solutions like close loop surface measurement for  automatic focus correction, provides extremely high accuracy and stability even for complex trajectories. User friendly software with CAD GUI enviroment (codeless  programming) ensure an efficient and fast process development.

Donwload DataSheets →

Features:

• Fixed optic head with automatic objective´s change.
• High Precision scanner head.
• Automatic change from Fixed head to Scanner setup.
• Co-lineal vision system with motorized optics.
• Co-lineal surface measurement laser system with close-loop correction or 2D scanning option.
• Automated camera calibration.
• Automated feature camera recognition for precision aligment and rotation compensation.
• Based on CAD GUI enviroment (Import DXF, DWG, DWT, ACIS… files).
• Class 1 high end enclosure with automatic door and HMI panel.

Aplications:

  • Solar Cell Processing
  • Wafer scribing and dicing
  • Laser cutting and drilling
  • Micromachinning
  • Marking
  • Via Hole Drilling
  • Welding
  • Ceramic Processing
  • 2 Photon Polymerization
  • Thermal Treatment
  • ITO Patterning
  • OLED Processing and much more…

Specifications:

Working Area 300 x 200 x 100 mm
Resolution  10 nm (XY), 0.3 μm (Z)
Repeteability  ± 40 nm (XY); ± 0.5 μm (Z)
Accuracy  ± 2.5 μm (XY); ± 2.5 μm (Z)
Available Laser Sources  From UV to IR. Pulsed or CW
Substrate Holder  250 x 200 mm Aluminium Vacuum Plate
Minimum Laser Spot Size  Typical from 1 μm
External Dimensions  1400 x 1500 x 2200 mm (W x D x H)
Weight Aprox.  1700 Kg without laser source
Control Unit Workstation with dual 23″ monitor

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LS-LAB

LS-LAB

CUSTOMIZABLE LASER PROCESSING MACHINE FOR HIGH ACCURACY APPLICATIONS

LS-LAB is a versatile compact workstation designed for high  demanding laser processing applications where nanometer resolutions and spot laser sizes down to 1 micron are required.  Based on aluminum and compact granite structure, LS-LAB provides with high accuracy and stability at an affordable  cost, integrating advanced solutions like close loop surface  measurement for automatic focus correction. User friendly  software with CAD GUI environment (codeless programming) ensure efficient and fast process development.
Download DataSheet →

Features:

• Fixed optic head with automatic objective´s change.
• Co-lineal vision system with motorized optics.
• Co-lineal surface measurement laser system with close-loop correction or 2D scanning option.
• Automated camera calibration.
• Automated feature camera recognition for precision aligment and rotation compensation.
• Based on CAD GUI enviroment (Import DXF, DWG, DWT, ACIS… files)
• Class 1 enclosure.

Aplications:

  • Solar Cell
  • Processing
  • Wafer scribing and dicing
  • Laser cutting and drilling
  • Micromachinning
  • Marking Via
  • Hole Drilling
  • Welding
  • Ceramic Processing
  • 2 Photon Polymerization
  • Thermal Treatment
  • ITO Patterning
  • OLED Processing and much more…

Specifications:

Working Area 200 x 100 x 20 mm
Resolution 20 nm (XY), 0.1 μm (Z)
Repeteability ± 0.3 μm (XY); ± 0.1 μm (Z)
Accuracy ± 2.5 μm (XY); ± 1 μm (Z)
Available Laser Sources From UV to IR. Pulsed or CW
Substrate Holder 100 x 100 mm Aluminium Vacuum Plate
Minimum Laser Spot Size Typical from 1 μm
External Dimensions 1400 x 1750 x 2050 mm (W x D x H)
Weight Aprox. 600 Kg without laser source
Control Unit Workstation with dual 23″ monitor

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Industrial Manufacturing

Lasers are used for a wide variety of industrial manufacturing applications, including stereolithography, rapid prototyping, laser shock processing, metals and plastic micromachining , intra-glass and other precision marking. The use of the most advanced lasers from Spectra-Physics plus Newport ultra-precise positioning stages let us develop very accurate laser systems with high demand specifications.

 

For more information about Industrial manufacturing applications please visit Spectra-Physics applications website: LINK

Glass Cutting

Spectra-Physics introduces ClearShape™, a patent-pending femtosecond laser process for highest quality, fast cutting of chemically strengthened glass, unstrengthened glass, and sapphire. At speeds over 1000 mm/sec, the new process results in several-fold improvement in cut quality over other laser processes: no chipping, Ra <0.1 µm edge roughness, and as-cut bending strength of >650 MPa for chemically strengthened glass. Using the widely deployed Spirit® family of industrial femtosecond lasers, the new process is ideal for 24/7 manufacturing of displays and windows for mobile devices, wearables, and other demanding applications.
PCB Drilling with Talon

CRFP Cutting

To demonstrate the capability of the Quasar UV laser Spectra-Physics machined 250 µm thick PAN-based CFRP plate material. Parameters varied: pulse width, power, repetition rate, and scanning speed. It is also tested the burst machining capability provided by Quasar’s TimeShift technology.
CRFP cutting with Quasar

PCB Drilling

Spectra-Physics is a leading supplier of lasers for the manufacture of printed circuit boards and microelectronics packaging. Spectra-Physics lasers are proven in a wide range of PCB applications including cutting, depaneling, via hole drilling, direct imaging, trimming, repair and marking. With thousands of lasers deployed in demanding PCB applications, Spectra-Physics delivers a broad portfolio of highly reliable, cost-effective lasers backed by our industry-leading global support organization.
Glass Cutting with Spirit

Semiconductor and LED Processing

Spectra-Physics is a leading supplier of lasers for the manufacture of semiconductors and LEDs. Spectra-Physics lasers are proven in a wide range of semiconductor and LED applications including LED scribing and lift-off, silicon scribing/dicing, wafer inspection, circuit trimming/repair and many other applications. With thousands of UV lasers deployed in demanding semiconductor and LED applications, Spectra-Physics delivers a broad portfolio of highly reliable, cost-effective lasers backed by our industry-leading global support organization.
LED Shappire Laser Scribing

Please, send us your questions or information queries and we will contact you very soon.




Laser Industrial Manufacturing. Laser Microsystems
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LS-CUSTOM

Custom based solutions for specific applications. More than 37 years of experience in Laser market makes us the perfect choice for beeing your partner integrator. If you need to find a solution form zero, just contact us and our R&D department will provide the answer to your needs. Lasing is involved in EU funded projects for machine development as LASHARE and APPOLO from FP7 program.

Designs based on:

  • Granite structures up to 2 Tn to provide stability and flatness.
  • Newport Ultra-precision stages based mainly in linear motors for high accelerations and speeds. Air bearing solutions available for ultra-smooth speed. More than 20 years of experience on Newport products integration!!! 
  • All laser sources based on Spectra-Physics technology, from UV to IR, CW or pulsed. We can cover almost all the applications with high precision and quality requirements. More than 35 years of experience on Spectra-Physics products integration!!!
  • Integration of all the different components and a user friendly software in Class 1 CE workstations.

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Medical Applications

Due to its unique capabilities, laser processing has become the predominant method of cutting, ablating, and welding materials for stent manufacturing. Compared to other cutting methods, laser processing produces very smooth edges that substantially reduce the finishing process. Another laser processing benefit is the ability to make intricate design cuts with extreme precision and accuracy.

For more information about Medical Applications please visit Spectra-Physics applications website: LINK

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Please, send us your questions or information queries and we will contact you very soon.




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Medical Applications. Laser Microsystems
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Solar/Photovoltaics Manufacturing

Laser processing is applicable to a wide range of PV technologies, from performing isolation scribes, dicing,  doping in thin c-Si cells film substrates  to process P1, P2, P3 and edge removal for Thin Film substrates.
 

Many years involved in PV laser processing applications and our relationship with applied R&D PV Laser Centre’s, gives us the experience to ensure high flexibility and powerful Hardware-Software development for your application.

For more information about Photovoltaic Manufacturing please visit Spectra-Physics applications website: LINK

Edge Isolation

Low and High magnification optical microscope images of 532nm laser
edge isolation scribe.
Depth profile (top) and microscope photo of edge isolation groove machined with Pulseo 355-20 laser system.
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Laser Marking & Engraving

Laser marking is widely used for small, medium and large-scale part marking, identification and traceability in a rapid and flexible process. Patterns include texts, 2D barcodes/data matrices, logos, bitmaps or any geometric shape. The use of cost effective lasers from IR to UV range makes laser marking one of the most demanding application in the market. 3D laser marking Lasing solutions  provides with the capability of marking any kind of shape at speeds of m/s.

 

Laser engraving provides significant advantages in terms of engraving flexibility, depth, surface finishing and “marking” size. High-quality and high speed engraving can be achieved for various materials bare and coated metal, ceramics, glass and polymers and in a broad range of industries as jewelry, fine art/printing modeling, electronics, automotive, and others.

 

For more information about Laser Marking please visit Spectra-Physics applications website: Link

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Please, send us your questions or information queries and we will contact you very soon.




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