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LS-FPRO

LS-FPRO

CUSTOMIZABLE LASER PROCESSING MACHINE FOR HIGH ACCURACY APPLICATIONS

LS-FPRO is a versatile workstation designed for high demanding  laser processing applications where nanometer resolutions and laser spot sizes down to 1 micron are required. The main heavy granite structure with pasive dampers and  advanced solutions like close loop surface measurement for  automatic focus correction, provides extremely high accuracy and stability even for complex trajectories. User friendly software with CAD GUI enviroment (codeless  programming) ensure an efficient and fast process development.

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Features:

• Fixed optic head with automatic objective´s change.
• High Precision scanner head.
• Automatic change from Fixed head to Scanner setup.
• Co-lineal vision system with motorized optics.
• Co-lineal surface measurement laser system with close-loop correction or 2D scanning option.
• Automated camera calibration.
• Automated feature camera recognition for precision aligment and rotation compensation.
• Based on CAD GUI enviroment (Import DXF, DWG, DWT, ACIS… files).
• Class 1 high end enclosure with automatic door and HMI panel.

Aplications:

  • Solar Cell Processing
  • Wafer scribing and dicing
  • Laser cutting and drilling
  • Micromachinning
  • Marking
  • Via Hole Drilling
  • Welding
  • Ceramic Processing
  • 2 Photon Polymerization
  • Thermal Treatment
  • ITO Patterning
  • OLED Processing and much more…

Specifications:

Working Area 300 x 200 x 100 mm
Resolution  10 nm (XY), 0.3 μm (Z)
Repeteability  ± 40 nm (XY); ± 0.5 μm (Z)
Accuracy  ± 2.5 μm (XY); ± 2.5 μm (Z)
Available Laser Sources  From UV to IR. Pulsed or CW
Substrate Holder  250 x 200 mm Aluminium Vacuum Plate
Minimum Laser Spot Size  Typical from 1 μm
External Dimensions  1400 x 1500 x 2200 mm (W x D x H)
Weight Aprox.  1700 Kg without laser source
Control Unit Workstation with dual 23″ monitor

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